Vertical Stacking in Intel's ZAM Memory Aims to Boost AI Processor Throughput ...

TL;DR: Intel and SoftBank unveiled next-generation ZAM memory prototypes featuring a unique Z-angle interconnect architecture that improves thermal management and reduces power consumption by 40-50%.

TOKYO--(BUSINESS WIRE)--Kioxia Corporation, a world leader in memory solutions, today announced the development and prototype demonstration of its new KIOXIA CM9 Series PCIe ® 5.0 NVMe™ SSDs. These ...

South Korean researchers have successfully developed a core technology that can fundamentally resolve "memory shortages," a ...

Artificial intelligence computing startup D-Matrix Corp. said today it has developed a new implementation of 3D dynamic random-access memory technology that promises to accelerate inference workloads ...

TL;DR: Intel partners with SoftBank's SAIMEMORY to advance next-generation DRAM bonding technology using Z-Angle Memory (ZAM), enabling higher capacity, lower power consumption, and improved ...