Texas Instruments (TI) Inc. has unveiled six new power modules that deliver benefits in power density, efficiency and thermal performance, while reducing size and electromagnetic interference (EMI).

The Vertex N G3 achieves its performance improvement through four technology upgrades: Ultra cell platform technology for higher power and bifaciality; multi-cut technology to reduce current losses; ...

In an exclusive interview with TI’s director of power management R&D, we explore the role of advanced packaging in low-voltage power electronics. From state-of-the-art materials and process technology ...

Founded in 1987, Boschman Technologies B.V. is a manufacturer of sintering equipment and transfer molding technology for advanced packaging of automotive and industrial power modules, MEMS sensors. In ...

AUBURN HILLS, Mich., April 29, 2025 /PRNewswire/ -- BorgWarner is set to showcase its latest technology at the 46th Vienna Motor Symposium from May 14-16, 2025, at the Hofburg in Vienna and will lead ...

Good morning, good evening. Thank you all for attending the conference call with ASE. I'm Sunny Lin, covering Greater China [ Semis ] at UBS. It's my great honor to host Mr. Yin Chang, Executive VP of ...

Researchers demonstrated a novel technique to efficiently convert ambient low-power radiofrequency signals into DC power. This 'rectifier' technology can be easily integrated into energy harvesting ...

Power electronics and semiconductor devices lie at the heart of modern energy conversion and control systems. Recent advances have focused on utilising wide‐bandgap materials such as silicon carbide ...

Founded in 2020, Powertrim Technologies is a provider of back-end packaging equipment for power modules. Rooted in over 40 years of semiconductor trim and form toolmaking heritage, the company offers ...

With the industry pushing the boundaries of solar efficiency, multi-cut technology has emerged as a critical pathway for boosting module power.

With the explosive increase in demand for artificial intelligence (AI), autonomous driving, Internet of Things (IoT), data centers, augmented reality and virtual reality (AR/VR), the market of ...