New integration and patterning schemes used in 3D memory and logic devices have created manufacturing and yield challenges. Industrial focus has shifted from the scaling of predictable unit processes ...

Continued scaling of integrated circuits to smaller dimensions is still a viable way to increase compute power, achieve higher memory cell density, or reduce power consumption. These days, chip makers ...

In smart manufacturing, timely and accurate data flow is critical. Manufacturers seek to monitor every step in their process to ensure optimal results. However, significant challenges include ...