Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...

Marks the world’s first implementation in a large-scale semiconductor manufacturing plant, with full-scale introduction in the EDS process planned for April 2024 Santa Clara, CA and Kyoto, Japan, Dec.

In smart manufacturing, timely and accurate data flow is critical. Manufacturers seek to monitor every step in their process to ensure optimal results. However, significant challenges include ...

Lucas M. Schroth and Urszula Jessen founded Process.Science to address inefficiencies in traditional data analysis. The company utilizes an AI-powered process mining platform that integrates ...

85% of enterprises want to become agentic within three years — yet 76% admit their operations can’t support it. According to the Celonis 2026 Process Optimization Report, based on a survey of more ...

Data Volume. Cloud usage generates data at a per-hour level that leads to volumes of data that can reach ~150TB, making it ...